AIM Photonics
Named in Dream Photonics' own timeline as a process design kit development collaboration launched in 2022.
Dream Photonics
QuantumSemiconductors & PhotonicsVancouver, BC
Vancouver silicon-photonics company spun out of UBC, supplying photonic IP, process design kits and photonic wire-bonding packaging for chip-to-fibre and laser integration, including quantum light sources.
Canadian innovation builds a brighter tomorrow.
About
Source: dreamphotonics.comDream Photonics states that it is “working to tackle the biggest challenges of the semiconductor era, leveraging our expertise and resources in the world of photonics and electronics.” Its own milestones record that it “Enabled the first open-access MPW tape-out with hybrid integrated lasers in collaboration with Applied Nanotools and CMC Microsystems”, and that it “enabled a fiber attach solution for AMF silicon photonics platform using photonic wirebonds”. Its Process Design Kit “enables a wide-range of custom applications” and includes “a selection of Dream Photonics leading-edge silicon-verified devices and application examples for O-band and C-band”.
States it received over $1 million from NSERC and the NRC in 2025 to embed quantum light sources into semiconductor platforms. dreamphotonics.com
Received NRC IRAP support in 2023 as one of 11 Canadian firms selected in a joint Canada-UK research call with UKRI. dreamphotonics.com
Received CMC FABrIC support in 2025 to develop wafer-scale optical packaging using 3D-printed optical components. dreamphotonics.com
States it signed its 35th customer in 2025. dreamphotonics.com
Partnerships
Publicly announced partnerships.
Applied Nanotools and CMC Microsystems
Named in its own timeline for a 2022 open-access multi-project wafer tape-out with hybrid integrated lasers.
People
Sourced from the company's own pages or announcements.
Lukas Chrostowski
Co-Founder
Sudip Shekhar
Co-Founder
Matthew Mitchell
Senior Scientist
Technology Focus
Company site: dreamphotonics.comTerms the company uses about its own work.
Photonic wire bondingFacet attached microlensesLaser integrationFibre integrationProcess design kits
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