Omniply Technologies
Montreal developer of a wafer platform and patented delamination technology that grows III-V semiconductor layers on large-format silicon wafers and separates thin-film circuits from rigid carriers, for microLED, silicon photonics and flexible electronics.
Canadian innovation builds a brighter tomorrow.
About
Source: omniplytech.comOmniply Technologies develops a semiconductor wafer platform and patented delamination technology. In its own words, "Our patent-protected delamination technology facilitates the separation of flexible circuits from their rigid carrier without compromising device performance." FABrIC describes its funded project as a next-generation III-V semiconductor wafer platform for large-format integrated photonics, aimed at eliminating small, expensive substrates such as GaN, sapphire and SiC through its OmniChip substrate platform incorporating next-generation delamination and near-zero-strain layers.
Received a $571,000 FABrIC award in June 2025 for a next-generation III-V semiconductor wafer platform for large-format integrated photonics. fabricinnovation.ca
FABrIC describes the project as eliminating small, expensive substrates such as GaN, sapphire and SiC via its patented OmniChip substrate platform. fabricinnovation.ca
States its patent-protected delamination technology separates flexible circuits from their rigid carrier without compromising device performance. omniplytech.com
FABrIC records it as spun out of Stanford and Purdue Universities. fabricinnovation.ca
Government & Grants
Government support actually received. Unpublished amounts are left out.
FABrIC, administered by CMC Microsystems, for a next-generation III-V semiconductor wafer platform for large-format integrated photonics
People
Sourced from the company's own pages or announcements.
Harit Doshi
Founding CEO & President
Humaira Taz
Co-Founder & CTO
Technology Focus
Company site: omniplytech.comTerms the company uses about its own work.
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